ACM Research's 'big year' arrives: panel-level plating orders and a 105% order surge flip the growth narrative
After a 2025 of cleaning softness and shipment declines, June-quarter orders doubled as ACM validated its five-year panel-level plating bet.
ACMR · Earnings Call · 2026-08-07
From shipment trough to order inflection
A year ago, ACM Research was explaining away a nasty slide: cleaning revenue was declining YoY, full-year shipments were set to fall for the first time in years, and an inventory write-down had dragged margins below its own target band. CFO Mark McKechnie admitted on the November 2025 call that “the full year would be down year-on-year, and that is different than what we had expected.” — Mark McKechnie, CFO · 2025-11-05 The June 2026 quarter is the sharp rebuttal. Revenue hit $292.9M, up 36% YoY, shipments matched at 36% — and the most telling number of all: production orders rose 105% in the first half. Management raised the low end of the full-year guide to a $1.125B–$1.175B range ($25–30% growth) and reiterated that shipments would outpace revenue. The catch-up is driven by exactly the products that were missing last year: SPM single-wafer tools (a third of the cleaning market ACM had barely touched) and the electroplating franchise, where the 2,000th chamber shipped in the quarter — a cadence of 500 (2022) → 1,500 (2025) → 2,000 (2026). Underneath it all, the economics changed: larger chip size and rising interconnect layer counts add copper steps, and high-bandwidth memory stacking multiplies them further.The panel bet lands a first-mover order
The headline event of the quarter is panel-level plating. David Wang announced two orders — a production tool for a Mainland China customer and an evaluation system for a new customer in Asia — for horizontal plating of glass/silicon panels:This validates a five-year bet ACM made when it "predicted a shift from wafer level to panel-level packaging more than 5 years ago." On the February call, Wang had staked the claim that “We are the first one in the world so far doing horizontal plating” — David Wang, CEO · 2026-02-26 — a position he argues is the key differentiator for the square-format, large-chip size future of AI packaging. The broad order book growth is encouraging, but it is this PLP proof-of-order that moves the stock narrative from "potential" to "validated."I'm pleased to announce that we have received order from 2 advanced packaging customers for our panel-level horizontal plating tool addressing both 510 x 515-millimeter and 310 x 310-millimeter panel size... We believe ACM will be among the first company to deliver horizontal panel level plating system to multiple customers across multiple regions.